Specification for flex - rigid multilayer printed boards with through connections 有貫穿連接的剛撓多層印制板規(guī)范
Sectional specification - flex - rigid multilayer printed boards with through connections ; german version en 123600 : 1996 分規(guī)范.帶貫通連接的彎曲剛性多層印制電路板
Printed wiring boards - specification for flex - rigid multilayer printed boards with through connections 印制電路板.第11部分:貫穿連接的撓性-剛性多層印制電路板規(guī)范
Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections 印制電路板.第11部分:有貫穿連接的彎曲剛性多層印制電路板規(guī)范
System of quality assessment - sectional specification - flex - rigid multilayer printed boards with through - connections 質(zhì)量評估體系.分規(guī)范.直通連接的軟-硬性多層印制板
System of quality assessment - capability detail specification - flex - rigid multilayer printed boards with through - connections 質(zhì)量評估體系.性能的詳細規(guī)范.直通連接的軟-硬性多層印制板
Printed boards ; part 11 : specification for flex - rigid multilayer printed boards with through connections ; identical with iec 60326 - 11 : 1991 印制電路板.第11部分:帶貫穿連接的剛性彎曲多層印制
Harmonized system of quality assessment for electronic components - sectional specification - flex - rigid multilayer printed boards with through connections 電子元器件質(zhì)量評定協(xié)調(diào)體系.分規(guī)范.柔性-剛性多層連接印制電路板
Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections 電子元器件用質(zhì)量評估協(xié)調(diào)體系.性能詳細規(guī)范:整體連接彎曲剛性多層印刷電路板